TSM60NB900CP ROG

Taiwan Semiconductor Corporation

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TSM60NB900CP ROG

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Package:

TO-252, (D-Pak)

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Description:

MOSFET N-CHANNEL 600V 4A TO252

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Mfr	Taiwan Semiconductor Corporation
Series	-
Package	Tape & Reel (TR)
FET Type	N-Channel
Vgs (Max)	±30V
Technology	MOSFET (Metal Oxide)
FET Feature	-
Mounting Type	Surface Mount
Package / Case	TO-252-3, DPak (2 Leads + Tab), SC-63
Product Status	Active
Vgs(th) (Max) @ Id	4V @ 250µA
Base Product Number	TSM60
Operating Temperature	-55°C ~ 150°C (TJ)
Rds On (Max) @ Id, Vgs	900mOhm @ 1.2A, 10V
Power Dissipation (Max)	36.8W (Tc)
Supplier Device Package	TO-252, (D-Pak)
Gate Charge (Qg) (Max) @ Vgs	9.6 nC @ 10 V
Drain to Source Voltage (Vdss)	600 V
Input Capacitance (Ciss) (Max) @ Vds	315 pF @ 100 V
Drive Voltage (Max Rds On, Min Rds On)	10V
Current - Continuous Drain (Id) @ 25°C	4A (Tc)