SP2-200X100-G

BusBoard Prototype Systems

Product No:

SP2-200X100-G

Package:

-

Batch:

-

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Description:

SMTPADS-2 200X100MIL PADS, TOP-S

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Product Information

Parameter Info

User Guide

Mfr BusBoard Prototype Systems
Pitch -
Series -
Package Bag
Plating Non-Plated Through Hole (NPTH)
Material FR4 Epoxy Glass
Edge Contacts -
Hole Diameter -
Product Status Active
Board Thickness 0.063" (1.60mm)
Circuit Pattern Pad Per Hole (Rectangular)
Proto Board Type Breadboard, General Purpose
Size / Dimension 3.94" L x 3.15" W (100.1mm x 80.0mm)