SMDSWLF.059 3.3 1LB

Chip Quik Inc.

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SMDSWLF.059 3.3 1LB

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Description:

SOLDER WIRE SN96.5/AG3.0/CU0.5

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In Stock : 20

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Mfr	Chip Quik Inc.
Form	Spool, 1 lb (453.59g)
Type	Wire Solder
Series	-
Weight	-
Package	Bulk
Process	Lead Free
Diameter	0.059" (1.50mm)
Flux Type	No-Clean, Water Soluble
Shelf Life	-
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	423 ~ 428°F (217 ~ 220°C)
Shipping Info	-
Product Status	Active
Shelf Life Start	-
Storage/Refrigeration Temperature	-