NC191SNL250

Chip Quik Inc.

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NC191SNL250

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Description:

SMOOTH FLOW LEAD-FREE SOLDER PAS

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Mfr	Chip Quik Inc.
Form	Jar, 8.8 oz (250g)
Type	Solder Paste
Series	Smooth Flow™
Package	Bulk
Process	Lead Free
Diameter	-
Flux Type	No-Clean
Mesh Type	4
Shelf Life	6 Months
Wire Gauge	-
Composition	Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point	422 ~ 428°F (217 ~ 220°C)
Product Status	Active
Shelf Life Start	Date of Manufacture
Base Product Number	NC191
Storage/Refrigeration Temperature	37°F ~ 46°F (3°C ~ 8°C)