HSS-B20-CP-01

CUI Devices

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HSS-B20-CP-01

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HEATSINK TO-220 2.6W ALUMINUM

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Mfr	CUI Devices
Type	Board Level
Shape	Rectangular, Fins
Width	0.900" (22.86mm)
Length	0.375" (9.53mm)
Series	HSS
Package	Box
Diameter	-
Material	Aluminum
Fin Height	0.740" (18.79mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Clip
Base Product Number	HSS-B20
Thermal Resistance @ Natural	28.85°C/W
Power Dissipation @ Temperature Rise	2.6W @ 75°C
Thermal Resistance @ Forced Air Flow	6.32°C/W @ 200 LFM