HSE-B500-04H

CUI Devices

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HSE-B500-04H

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HEAT SINK, EXTRUSION, TO-220, 50

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Mfr	CUI Devices
Type	Board Level, Vertical
Shape	Rectangular, Fins
Width	1.378" (35.00mm)
Length	1.969" (50.00mm)
Series	HSE
Package	Box
Diameter	-
Material	Aluminum Alloy
Fin Height	1.000" (25.40mm)
Package Cooled	TO-220
Product Status	Active
Material Finish	Black Anodized
Attachment Method	Bolt On and PC Pin
Base Product Number	HSE-B500
Thermal Resistance @ Natural	8.05°C/W
Power Dissipation @ Temperature Rise	12.2W @ 75°C
Thermal Resistance @ Forced Air Flow	2.88°C/W @ 200 LFM