CQ-SS-SNBIAG-0.25MM-25000

Chip Quik Inc.

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SOLDER SPHERES SN42/BI57.6/AG0.4

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Mfr	Chip Quik Inc.
Form	Jar
Type	Solder Sphere
Series	-
Weight	-
Package	Bulk
Process	-
Diameter	0.010" (0.25mm)
Flux Type	-
Shelf Life	24 Months
Wire Gauge	-
Composition	Bi57.6Sn42Ag0.4 (57.6/42/0.4)
Melting Point	280°F (138°C)
Shipping Info	-
Product Status	Active
Shelf Life Start	Date of Manufacture
Storage/Refrigeration Temperature	-