96-208M50

Aries Electronics

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96-208M50

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SOCKET ADAPTER QFP TO 208PGA

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Mfr	Aries Electronics
Series	Correct-A-Chip® 96-208M50
Package	Bulk
Features	-
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Mounting Type	Through Hole
Board Material	FR4 Epoxy Glass
Number of Pins	208
Pitch - Mating	0.020" (0.50mm)
Product Status	Active
Housing Material	-
Base Product Number	96-208M
Contact Finish - Post	Tin-Lead
Operating Temperature	-
Contact Finish - Mating	Tin
Contact Material - Post	Brass
Termination Post Length	0.125" (3.18mm)
Convert To (Adapter End)	PGA
Contact Material - Mating	Copper
Convert From (Adapter End)	QFP
Material Flammability Rating	-
Contact Finish Thickness - Post	200.0µin (5.08µm)
Contact Finish Thickness - Mating	-